1. product profile 1.1 general description npn/pnp general-purpose double transistors. 1.2 features ? simplified circuit design ? reduced component count ? reduced pick and place costs 1.3 applications ? general-purpose switching and amplification 1.4 quick reference data PIMZ2; pumz2 npn/pnp general-purpose double transistors rev. 06 ? 17 november 2009 product data sheet table 1. product overview type number package configuration nxp jeita PIMZ2 sot457 sc-74 npn/pnp double transistors pumz2 sot363 sc-88 npn/pnp double transistors table 2. quick reference data symbol parameter conditions min typ max unit v ceo collector-emitter voltage open base - - 50 v i c collector current (dc) - - 150 ma
PIMZ2_pumz2_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 ? 17 november 2009 2 of 9 nxp semiconductors PIMZ2; pumz2 npn/pnp general-purpose double transistors 2. pinning information 3. ordering information 4. marking [1] * = -: made in hong kong * = t: made in malaysia * = w: made in china table 3. pinning pin description simplified outline symbol PIMZ2 (sot457) 1 collector tr2 2emitter tr2 3 collector tr1 4emitter tr1 5 base tr1 6 base tr2 pumz2 (sot363) 1emitter tr1 2 base tr1 3 base tr2 4 collector tr2 5emitter tr2 6 collector tr1 13 2 4 5 6 sym08 2 13 2 4 5 6 tr1 tr2 13 2 4 5 6 sym08 3 13 2 tr1 4 5 6 tr2 table 4. ordering information type number package name description version PIMZ2 sc-74 plastic surface mounted package; 6 leads sot457 pumz2 sc-88 plastic surface mounted package; 6 leads sot363 table 5. marking codes type number marking code [1] PIMZ2 m6 pumz2 gz*
PIMZ2_pumz2_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 ? 17 november 2009 3 of 9 nxp semiconductors PIMZ2; pumz2 npn/pnp general-purpose double transistors 5. limiting values [1] device mounted on an fr4 printed-circuit board. 6. thermal characteristics [1] device mounted on an fr4 printed-circuit board. table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per transistor; for the pnp transistor with negative polarity v cbo collector-base voltage open emitter - 60 v v ceo collector-emitter voltage open base - 50 v v ebo emitter-base voltage open collector - 7 v i c collector current (dc) - 150 ma i cm peak collector current - 200 ma i bm peak base current - 100 ma p tot total power dissipation t amb 25 c sot457 [1] -200mw sot363 [1] -180mw t stg storage temperature ? 65 +150 c t j junction temperature - 150 c t amb ambient temperature ? 65 +150 c per device p tot total power dissipation t amb 25 c sot457 [1] -300mw sot363 [1] -300mw table 7. thermal characteristics symbol parameter conditions min typ max unit per transistor r th(j-a) thermal resistance from junction to ambient t amb 25 c sot457 [1] --625k/w sot363 [1] --694k/w per device r th(j-a) thermal resistance from junction to ambient t amb 25 c sot457 [1] --417k/w sot363 [1] --417k/w
PIMZ2_pumz2_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 ? 17 november 2009 4 of 9 nxp semiconductors PIMZ2; pumz2 npn/pnp general-purpose double transistors 7. characteristics table 8. characteristics t amb = 25 c unless otherwise specified. symbol parameter conditions min typ max unit per transistor; for the pnp transistor with negative polarity; un less otherwise specified i cbo collector-base cut-off current v cb =60v; i e =0 a - - 100 na v cb =60v; i e =0 a; t j = 150 c--50 a i ebo emitter-base cut-off current v eb =7v; i c =0 a - - 100 na h fe dc current gain v ce =6v; i c = 1 ma 120 250 560 tr1 (pnp) v cesat collector-emitter saturation voltage i c = ? 50 ma; i b = ? 5ma - - ? 500 mv f t transition frequency i e = ? 2ma; v ce = ? 12 v; f = 100 mhz - 190 - mhz c c collector capacitance i e =i e =0 a; v cb = ? 12 v; f = 1 mhz - 2.3 5 pf tr2 (npn) v cesat collector-emitter saturation voltage i c =50ma; i b =5ma - - 250 mv f t transition frequency i e =2ma; v ce = 12 v; f = 100 mhz 100 - - mhz c c collector capacitance i e =i e =0 a; v cb =12v; f=1mhz - - 3 pf
PIMZ2_pumz2_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 ? 17 november 2009 5 of 9 nxp semiconductors PIMZ2; pumz2 npn/pnp general-purpose double transistors 8. package outline fig 1. package outline sot457 (sc-74) references outline version european projection issue date iec jedec jeita sot457 sc-74 wb m b p d e pin 1 index a a 1 l p q detail x h e e v m a a b y scale c x 13 2 4 5 6 0 1 2 mm plastic surface-mounted package (tsop6); 6 leads sot45 7 unit a 1 b p cd e h e l p qy w v mm 0.1 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.6 0.2 0.33 0.23 a 1.1 0.9 05-11-07 06-03-16
PIMZ2_pumz2_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 ? 17 november 2009 6 of 9 nxp semiconductors PIMZ2; pumz2 npn/pnp general-purpose double transistors fig 2. package outline sot363 (sc-88) references outline version european projection issue date iec jedec jeita sot363 sc-88 wb m b p d e 1 e pin 1 index a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 6 plastic surface-mounted package; 6 leads sot36 3 unit a 1 max b p cd e e 1 h e l p qy w v mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.45 0.15 0.25 0.15 a 1.1 0.8 04-11-08 06-03-16
PIMZ2_pumz2_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 ? 17 november 2009 7 of 9 nxp semiconductors PIMZ2; pumz2 npn/pnp general-purpose double transistors 9. revision history table 9. revision history document id release date data sheet status change notice supersedes PIMZ2_pumz2_6 20091117 product data sheet - PIMZ2_pumz2_5 modifications: ? this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content. ? table 3 ? pinning ? : updated ? figure 1 ? package outline sot457 (sc-74) ? : updated ? figure 2 ? package outline sot363 (sc-88) ? : updated PIMZ2_pumz2_5 20041124 product data sheet - PIMZ2_pumz2_4 PIMZ2_pumz2_4 20031217 product specification - PIMZ2_2 PIMZ2_2 20030714 product specification - PIMZ2_1 PIMZ2_1 20030602 objective specification - -
PIMZ2_pumz2_6 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 06 ? 17 november 2009 8 of 9 nxp semiconductors PIMZ2; pumz2 npn/pnp general-purpose double transistors 10. legal information 10.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 10.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 disclaimers general ? information in this document is believed to be accurate and reliable. however, nxp semiconductors d oes not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale ? nxp semiconductors products are sold subject to the general terms and condit ions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writ ing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 10.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 11. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
nxp semiconductors PIMZ2; pumz2 npn/pnp general-purpose double transistors ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 17 november 2009 document identifier: PIMZ2_pumz2_6 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 12. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 10.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 10.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 contact information. . . . . . . . . . . . . . . . . . . . . . 8 12 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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